Solder paste is a mixture of flux and powdered solder. The process of attaching electrical components to the contact pads is called reflow soldering. During this process, the controlled heat within SMT reflow soldering oven melts the solder, to connect the joints permanently. Special models are designed to meet high thermal requirements and fine mesh belts for miniature parts.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
Smaller, bench-top models can be used in labs, for educational purposes, testing or smaller productions. Larger, medium to high volume models are more convenient for larger manufacturing demands, and there are also nitrogen based models available. In any case, if you compare these machines to standard ones, they don't need so much space, they consume less energy and provide more than satisfying performance.
With at least four independently controlled heating zones, medium to high volume machines are additionally equipped with numerous very useful things, including independent thermocouple inputs. Computer operated and calculated functions make these devices easy to operate and maintain. Smaller devices are often used for prototyping, for example.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
Smaller, bench-top models can be used in labs, for educational purposes, testing or smaller productions. Larger, medium to high volume models are more convenient for larger manufacturing demands, and there are also nitrogen based models available. In any case, if you compare these machines to standard ones, they don't need so much space, they consume less energy and provide more than satisfying performance.
With at least four independently controlled heating zones, medium to high volume machines are additionally equipped with numerous very useful things, including independent thermocouple inputs. Computer operated and calculated functions make these devices easy to operate and maintain. Smaller devices are often used for prototyping, for example.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
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